MC74HC595ADR2 vs TC74HC595AFN(TP1) feature comparison

MC74HC595ADR2 Freescale Semiconductor

Buy Now Datasheet

TC74HC595AFN(TP1) Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Lifetime Buy
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS TOSHIBA CORP
Package Description SOP, SOP16,.25 SOP,
Reach Compliance Code unknown unknown
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Max Frequency@Nom-Sup 20000000 Hz
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supplies 2/6 V
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 5 1
Pbfree Code No
Part Package Code SOIC
Pin Count 16
Additional Feature PARALLEL OUTPUT IS REGISTERED; UNREGISTERED SERIAL SHIFT RIGHT OUTPUT
Count Direction RIGHT
Family HC/UH
Length 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type SERIAL IN PARALLEL OUT
Output Characteristics 3-STATE
Output Polarity TRUE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 31 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm
fmax-Min 25 MHz

Compare TC74HC595AFN(TP1) with alternatives