MC74LCX157SDR2 vs SN74LVC157APWTE4 feature comparison

MC74LCX157SDR2 Motorola Mobility LLC

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SN74LVC157APWTE4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TEXAS INSTRUMENTS INC
Part Package Code SOIC TSSOP
Package Description SSOP, TSSOP, TSSOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 6.2 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Equivalence Code SSOP16,.3 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.99 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.29 mm 4.4 mm
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6.4 ns
Propagation Delay (tpd) 14 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

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Compare SN74LVC157APWTE4 with alternatives