MC8640DTHX1000HE vs MC8640DHX1000HE feature comparison

MC8640DTHX1000HE Freescale Semiconductor

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MC8640DHX1000HE Freescale Semiconductor

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 33 X 33 MM, CERAMIC, FCBGA-1023 33 X 33 MM, CERAMIC, FCBGA-1023
Pin Count 1023 1023
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.1 3A991
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166.66 MHz 166.66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B1023 S-CBGA-B1023
JESD-609 Code e0 e0
Length 33 mm 33 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 1023 1023
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA1023,32X32,40 BGA1023,32X32,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.97 mm 2.97 mm
Speed 1000 MHz 1000 MHz
Supply Voltage-Max 1.1 V 1.1 V
Supply Voltage-Min 1 V 1 V
Supply Voltage-Nom 1.05 V 1.05 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 33 mm 33 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1

Compare MC8640DTHX1000HE with alternatives

Compare MC8640DHX1000HE with alternatives