MC8640DTHX1000HE vs MC8641DVU1333HC feature comparison

MC8640DTHX1000HE Freescale Semiconductor

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MC8641DVU1333HC NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 33 X 33 MM, CERAMIC, FCBGA-1023 BGA,
Pin Count 1023
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.1 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 16
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166.66 MHz 166.66 MHz
External Data Bus Width 32 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B1023 S-CBGA-B1023
JESD-609 Code e0
Length 33 mm 33 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 1023 1023
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA1023,32X32,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.97 mm 2.77 mm
Speed 1000 MHz 1333 MHz
Supply Voltage-Max 1.1 V 1.1 V
Supply Voltage-Min 1 V 1 V
Supply Voltage-Nom 1.05 V 1.05 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 33 mm 33 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1

Compare MC8640DTHX1000HE with alternatives

Compare MC8641DVU1333HC with alternatives