MC8640DVJ1000HE vs MC8640DTVJ1000HE feature comparison

MC8640DVJ1000HE NXP Semiconductors

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MC8640DTVJ1000HE NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description FCBGA-1023 HBGA, BGA1023,32X32,40
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.1 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 2 Days
Samacsys Manufacturer NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166.66 MHz 166.66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B1023 S-CBGA-B1023
JESD-609 Code e2 e2
Length 33 mm 33 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 3
Number of DMA Channels 4 4
Number of Terminals 1023 1023
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC CERAMIC
Package Code HBGA HBGA
Package Equivalence Code BGA1023,32X32,40 BGA1023,32X32,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245 245
Seated Height-Max 2.77 mm 2.77 mm
Speed 1000 MHz 1000 MHz
Supply Voltage-Max 1.1 V 1.1 V
Supply Voltage-Min 1 V 1 V
Supply Voltage-Nom 1.05 V 1.05 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 33 mm 33 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare MC8640DVJ1000HE with alternatives

Compare MC8640DTVJ1000HE with alternatives