MC8640DVJ1000HE
vs
MC8640DVJ1000HC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
FCBGA-1023
|
BGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.1
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
2 Days
|
|
| Samacsys Manufacturer |
NXP
|
|
| Address Bus Width |
32
|
16
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
166.66 MHz
|
166.66 MHz
|
| External Data Bus Width |
32
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CBGA-B1023
|
S-CBGA-B1023
|
| JESD-609 Code |
e2
|
|
| Length |
33 mm
|
33 mm
|
| Low Power Mode |
NO
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of DMA Channels |
4
|
|
| Number of Terminals |
1023
|
1023
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
HBGA
|
BGA
|
| Package Equivalence Code |
BGA1023,32X32,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Seated Height-Max |
2.77 mm
|
2.77 mm
|
| Speed |
1000 MHz
|
1000 MHz
|
| Supply Voltage-Max |
1.1 V
|
1.1 V
|
| Supply Voltage-Min |
1 V
|
1 V
|
| Supply Voltage-Nom |
1.05 V
|
1.05 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Silver (Sn/Ag)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
33 mm
|
33 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC8640DVJ1000HE with alternatives
Compare MC8640DVJ1000HC with alternatives