MC9328MX1VM20
vs
MPC850DHZT66A
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Package Description |
14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, MAPBGA-256
|
BGA,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
25
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
16 MHz
|
|
External Data Bus Width |
32
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B256
|
R-PBGA-B256
|
Length |
14 mm
|
|
Low Power Mode |
NO
|
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,32
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
|
Speed |
200 MHz
|
|
Supply Voltage-Max |
2 V
|
|
Supply Voltage-Min |
1.8 V
|
|
Supply Voltage-Nom |
1.9 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
4
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
Additional Feature |
|
SUPPORTS MULTICHANNEL HDLC
|
|
|
|
Compare MPC850DHZT66A with alternatives