MC9328MX21SCVKR2 vs TMP19A61F10XBG feature comparison

MC9328MX21SCVKR2 NXP Semiconductors

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TMP19A61F10XBG Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Package Description 14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, MAPBGA-289 TFBGA, BGA289,20X20,20
Reach Compliance Code compliant unknown
ECCN Code 5A992.C
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Address Bus Width 26 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 32 MHz 13.5 MHz
External Data Bus Width 32 16
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PBGA-B289 S-PBGA-B289
JESD-609 Code e1
Length 14 mm 11 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 289 289
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.49 mm 1.06 mm
Speed 266 MHz 54 MHz
Supply Voltage-Max 1.65 V 1.65 V
Supply Voltage-Min 1.45 V 1.35 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 14 mm 11 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 289
Additional Feature SEATED HGT-NOM
Package Equivalence Code BGA289,20X20,20
RAM (bytes) 49152
ROM (words) 1048576
ROM Programmability FLASH
Supply Current-Max 49 mA

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