MC9328MXLVF20 vs MC9328MXLVF20 feature comparison

MC9328MXLVF20 Motorola Mobility LLC

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MC9328MXLVF20 Freescale Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LFBGA, BGA225,15X15,32 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225
Pin Count 225 225
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 25 25
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 16 MHz 16 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B225 S-PBGA-B225
Length 13 mm 13 mm
Low Power Mode YES YES
Number of Terminals 225 225
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA225,15X15,32 BGA225,15X15,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Speed 200 MHz 200 MHz
Supply Voltage-Max 2 V 2 V
Supply Voltage-Min 1.8 V 1.8 V
Supply Voltage-Nom 1.9 V 1.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 3
Rohs Code No
ECCN Code 3A991
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Time@Peak Reflow Temperature-Max (s) 30

Compare MC9328MXLVF20 with alternatives

Compare MC9328MXLVF20 with alternatives