MC9S08AC128CFUE vs MC9S08AC128MFUE feature comparison

MC9S08AC128CFUE NXP Semiconductors

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MC9S08AC128MFUE NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description ROHS COMPLIANT, QFP-64 ROHS COMPLIANT, QFP-64
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e3
Length 14 mm 14 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 54 54
Number of Terminals 64 64
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code QFP64,.7SQ,32 QFP64,.7SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 8192 8192
ROM (words) 131072 131072
ROM Programmability FLASH FLASH
Seated Height-Max 2.45 mm 2.45 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 2.7 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1