MC9S08LC36CLK vs MC9S08SH4CSCR feature comparison

MC9S08LC36CLK NXP Semiconductors

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MC9S08SH4CSCR Freescale Semiconductor

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 12 X 12 MM, 1 MM HEIGHT, ROHS COMPLIANT, LQFP-80 MS-012AA, SOIC-8
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code S-PQFP-G80 R-PDSO-G8
Length 12 mm
Number of I/O Lines 24
Number of Terminals 80 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP SOP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm
Speed 16 MHz 40 MHz
Supply Voltage-Max 1.8 V
Supply Voltage-Min 0.9 V
Supply Voltage-Nom 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Width 12 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
JESD-609 Code e3
Moisture Sensitivity Level 3
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 260
RAM (bytes) 256
ROM (words) 4096
Supply Current-Max 7.7 mA
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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Compare MC9S08SH4CSCR with alternatives