MC9S08LC36CLK
vs
MC9S08SH4MWJR
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP,
|
1.27 MM PITCH, MS-013AC, SOIC-20
|
| Pin Count |
80
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G80
|
R-PDSO-G20
|
| Length |
12 mm
|
12.8 mm
|
| Number of I/O Lines |
24
|
17
|
| Number of Terminals |
80
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
16 MHz
|
40 MHz
|
| Supply Voltage-Max |
1.8 V
|
5.5 V
|
| Supply Voltage-Min |
0.9 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
12 mm
|
7.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
| Boundary Scan |
|
NO
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
SOP20,.4
|
| RAM (bytes) |
|
256
|
| ROM (words) |
|
4096
|
| Supply Current-Max |
|
7.7 mA
|
| Supply Voltage-Nom |
|
3 V
|
|
|
|
Compare MC9S08LC36CLK with alternatives
Compare MC9S08SH4MWJR with alternatives