MC9S08QD2CPC vs MC9S08SH8MSCR feature comparison

MC9S08QD2CPC NXP Semiconductors

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MC9S08SH8MSCR NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description ROHS COMPLIANT, PLASTIC, DIP-8 MS-012AA, SOIC-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES YES
Additional Feature IT ALSO OPERATES AT 3V SUPPLY
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 38.4 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3
Length 9.779 mm 4.9 mm
Number of I/O Lines 4 6
Number of Terminals 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (bytes) 128 512
ROM (words) 2048 8192
ROM Programmability FLASH FLASH
Seated Height-Max 5.334 mm
Speed 16 MHz 40 MHz
Supply Current-Max 2.2 mA 7.7 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 2.7 V
Supply Voltage-Nom 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 3.9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Boundary Scan NO

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Compare MC9S08SH8MSCR with alternatives