MC9S08QE16CLD
vs
MC9S08QE16CLD
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ROCHESTER ELECTRONICS INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
NXP
|
|
| Bit Size |
8
|
|
| CPU Family |
HCS08
|
|
| JESD-30 Code |
S-PQFP-G44
|
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
44
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QFP
|
|
| Package Equivalence Code |
QFP44,.47SQ,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
1024
|
|
| ROM (words) |
16384
|
|
| ROM Programmability |
FLASH
|
|
| Speed |
50.33 MHz
|
|
| Supply Current-Max |
15 mA
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
,
|
|
|
|