MC9S08QE16CLD
vs
MC9S08QE16CLD
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
13 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| Boundary Scan |
|
NO
|
| CPU Family |
|
HCS08
|
| Clock Frequency-Max |
|
16 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQFP-G44
|
| JESD-609 Code |
|
e3
|
| Length |
|
10 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of I/O Lines |
|
34
|
| Number of Terminals |
|
44
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QFP
|
| Package Equivalence Code |
|
QFP44,.47SQ,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
1024
|
| ROM (words) |
|
16384
|
| ROM Programmability |
|
FLASH
|
| Speed |
|
50.33 MHz
|
| Supply Current-Max |
|
15 mA
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
1.8 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
10 mm
|
|
|
|