MC9S08QE8CLC vs MC9S08QE8CPG feature comparison

MC9S08QE8CLC Rochester Electronics LLC

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MC9S08QE8CPG NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP, ROHS COMPLIANT, PLASTIC, DIP-16
Pin Count 32
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G32 R-PDIP-T16
JESD-609 Code e3 e3
Length 7 mm 19.175 mm
Moisture Sensitivity Level 3
Number of I/O Lines 28 14
Number of Terminals 32 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP DIP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
ROM Programmability FLASH FLASH
Seated Height-Max 1.4 mm 4.44 mm
Speed 20 MHz 20 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
On Chip Program ROM Width 8
Package Equivalence Code DIP16,.3
Qualification Status Not Qualified
RAM (bytes) 512
ROM (words) 8192

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