MC9S08RE16CPE
vs
MC9S08RG32CFGE
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
DIP
|
QFP
|
| Package Description |
DIP,
|
LQFP,
|
| Pin Count |
28
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T28
|
S-PQFP-G44
|
| Length |
36.83 mm
|
10 mm
|
| Number of I/O Lines |
23
|
39
|
| Number of Terminals |
28
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
LQFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
5.08 mm
|
1.6 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MC9S08RE16CPE with alternatives
Compare MC9S08RG32CFGE with alternatives