MC9S08RE8DWE
vs
MC9S08RG32CFGE
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
ROHS COMPLIANT, MS-013AE, SOIC-28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
HCS08
|
HCS08
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-PDSO-G28
|
S-PQFP-G44
|
| Length |
17.925 mm
|
10 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of External Interrupts |
1
|
1
|
| Number of I/O Lines |
23
|
39
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
28
|
44
|
| Number of Timers |
3
|
3
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LQFP
|
| Package Equivalence Code |
SOP28,.4
|
QFP44,.47SQ,32
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
1024
|
2048
|
| ROM (words) |
8192
|
32768
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.65 mm
|
1.6 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Current-Max |
4.8 mA
|
4.8 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.5 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
4 Weeks
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MC9S08RE8DWE with alternatives
Compare MC9S08RG32CFGE with alternatives