MC9S08RG32CFGE vs MC9S08RE8CFDE feature comparison

MC9S08RG32CFGE NXP Semiconductors

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MC9S08RE8CFDE NXP Semiconductors

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Boundary Scan NO NO
CPU Family HCS08 HCS08
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G44 S-XQCC-N48
Length 10 mm 7 mm
Low Power Mode YES YES
Number of External Interrupts 1 1
Number of I/O Lines 39 39
Number of Serial I/Os 1 1
Number of Terminals 44 48
Number of Timers 3 3
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LQFP HVQCCN
Package Equivalence Code QFP44,.47SQ,32 LCC48,.27SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
RAM (bytes) 2048 1024
ROM (words) 32768 8192
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 2
Package Description 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL

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