MC9S08RG32FGE vs MC9S08RD8CFJE feature comparison

MC9S08RG32FGE NXP Semiconductors

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MC9S08RD8CFJE NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 10 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BCB, LQFP-44 ,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G44 S-PQFP-G32
JESD-609 Code e3
Length 10 mm 7 mm
Moisture Sensitivity Level 3
Number of I/O Lines 39 27
Number of Terminals 44 32
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP44,.47SQ,32 QFP32,.35SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
RAM (bytes) 2048 1024
ROM (words) 32768 8192
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 10 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
CPU Family HCS08
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of External Interrupts 1
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8

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