MC9S08RG32FGE vs MC9S08RE8CFDE feature comparison

MC9S08RG32FGE NXP Semiconductors

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MC9S08RE8CFDE Freescale Semiconductor

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 10 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BCB, LQFP-44 HVQCCN,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Boundary Scan NO
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G44 S-XQCC-N48
JESD-609 Code e3
Length 10 mm 7 mm
Moisture Sensitivity Level 3
Number of I/O Lines 39 39
Number of Terminals 44 48
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LQFP HVQCCN
Package Equivalence Code QFP44,.47SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 2048
ROM (words) 32768
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Part Package Code QFN
Pin Count 48

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