MC9S08RG32FJE vs MC9S08RE8CFDE feature comparison

MC9S08RG32FJE NXP Semiconductors

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MC9S08RE8CFDE NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Technology CMOS CMOS
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Package Description 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48
Has ADC NO
Address Bus Width
Bit Size 8
Boundary Scan NO
CPU Family HCS08
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-XQCC-N48
Length 7 mm
Low Power Mode YES
Number of External Interrupts 1
Number of I/O Lines 39
Number of Serial I/Os 1
Number of Terminals 48
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC48,.27SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified
RAM (bytes) 1024
ROM (words) 8192
ROM Programmability FLASH
Seated Height-Max 1 mm
Speed 8 MHz
Supply Current-Max 4.8 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 7 mm

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Compare MC9S08RE8CFDE with alternatives