MC9S08RG32FJE
vs
MC9S08RG32FJ
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
3
|
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
MATTE TIN
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFP
|
| Package Description |
|
LQFP, QFP32,.35SQ,32
|
| Pin Count |
|
32
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| Clock Frequency-Max |
|
16 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQFP-G32
|
| Length |
|
7 mm
|
| Number of I/O Lines |
|
27
|
| Number of Terminals |
|
32
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LQFP
|
| Package Equivalence Code |
|
QFP32,.35SQ,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
2048
|
| ROM (words) |
|
32768
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.6 mm
|
| Speed |
|
8 MHz
|
| Supply Current-Max |
|
4.8 mA
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
1.8 V
|
| Supply Voltage-Nom |
|
2 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
7 mm
|
|
|
|
Compare MC9S08RG32FJE with alternatives
Compare MC9S08RG32FJ with alternatives