MC9S08RG32FJR2
vs
MC9S08RE8CFDE
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
|
7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48
|
| Pin Count |
32
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G32
|
S-XQCC-N48
|
| JESD-609 Code |
e0
|
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
27
|
39
|
| Number of Terminals |
32
|
48
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
LQFP
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
1 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.8 V
|
3 V
|
| Supply Voltage-Nom |
2 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Boundary Scan |
|
NO
|
| CPU Family |
|
HCS08
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Low Power Mode |
|
YES
|
| Number of External Interrupts |
|
1
|
| Number of Serial I/Os |
|
1
|
| Number of Timers |
|
3
|
| On Chip Data RAM Width |
|
8
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
LCC48,.27SQ,20
|
| RAM (bytes) |
|
1024
|
| ROM (words) |
|
8192
|
| Supply Current-Max |
|
4.8 mA
|
|
|
|
Compare MC9S08RG32FJR2 with alternatives
Compare MC9S08RE8CFDE with alternatives