MC9S08RG32PE vs MC9S08RG32CFGE feature comparison

MC9S08RG32PE NXP Semiconductors

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MC9S08RG32CFGE NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description ROHS COMPLIANT, PLASTIC, DIP-28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T28 S-PQFP-G44
Length 36.83 mm 10 mm
Number of I/O Lines 23 39
Number of Terminals 28 44
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP LQFP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK, LOW PROFILE
Qualification Status Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 5.08 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position DUAL QUAD
Width 15.24 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Factory Lead Time 4 Weeks
Boundary Scan NO
CPU Family HCS08
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of External Interrupts 1
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Package Equivalence Code QFP44,.47SQ,32
Peak Reflow Temperature (Cel) 260
RAM (bytes) 2048
ROM (words) 32768
Supply Current-Max 4.8 mA
Time@Peak Reflow Temperature-Max (s) 40

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Compare MC9S08RG32CFGE with alternatives