MC9S08RG32PE vs MC9S08RE16CFJE feature comparison

MC9S08RG32PE NXP Semiconductors

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MC9S08RE16CFJE Freescale Semiconductor

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description ROHS COMPLIANT, PLASTIC, DIP-28 LQFP, QFP32,.35SQ,32
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T28 S-PQFP-G32
Length 36.83 mm 7 mm
Number of I/O Lines 23 27
Number of Terminals 28 32
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP LQFP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 5.08 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position DUAL QUAD
Width 15.24 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code QFP
Pin Count 32
ECCN Code EAR99
JESD-609 Code e3
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code QFP32,.35SQ,32
Peak Reflow Temperature (Cel) 260
RAM (bytes) 1024
ROM (words) 16384
Supply Current-Max 4.8 mA
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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