MC9S08SH4MPJ
vs
MB95F273KPF-G-SNE2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
SPANSION INC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, PLASTIC, DIP-20
|
SOP,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
32.5 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Length |
24.69 mm
|
5.3 mm
|
| Number of I/O Lines |
18
|
5
|
| Number of Terminals |
20
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP20,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
256
|
|
| ROM (words) |
4096
|
12288
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
5.08 mm
|
2.1 mm
|
| Speed |
40 MHz
|
32.5 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
4.5 V
|
| Supply Voltage-Nom |
3 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
5.24 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
3
|
4
|
|
|
|
Compare MC9S08SH4MPJ with alternatives
Compare MB95F273KPF-G-SNE2 with alternatives