MC9S08SH4MTJ
vs
S9S08QD2CSC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
|
| Package Description |
0.65 MM PITCH, TSSOP-20
|
ROHS COMPLIANT, MS-012AA, SOIC-8
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Length |
6.5 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
18
|
4
|
| Number of Terminals |
20
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.2 mm
|
1.75 mm
|
| Speed |
40 MHz
|
16 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4.4 mm
|
3.9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
3
|
2
|
| HTS Code |
|
8542.31.00.01
|
| Date Of Intro |
|
2016-03-17
|
|
|
|
Compare MC9S08SH4MTJ with alternatives
Compare S9S08QD2CSC with alternatives