MC9S08SH4MTJR vs MC9S08QD2MPC feature comparison

MC9S08SH4MTJR Freescale Semiconductor

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MC9S08QD2MPC Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code TSSOP DIP
Package Description 0.65 MM PITCH, TSSOP-20 ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count 20 8
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Bit Size 8 8
JESD-30 Code R-PDSO-G20 R-PDIP-T8
JESD-609 Code e3 e3
Moisture Sensitivity Level 3
Number of Terminals 20 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP20,.25 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 128
ROM (words) 4096 2048
ROM Programmability FLASH FLASH
Speed 40 MHz 16 MHz
Supply Current-Max 7.7 mA 2.2 mA
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.635 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Pbfree Code Yes
ECCN Code EAR99
Has ADC YES
Address Bus Width
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
Length 9.779 mm
Number of I/O Lines 6
On Chip Program ROM Width 8
PWM Channels YES
Seated Height-Max 5.334 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 2.7 V
Supply Voltage-Nom 3 V
Width 7.62 mm

Compare MC9S08SH4MTJR with alternatives

Compare MC9S08QD2MPC with alternatives