MC9S08SH8CPJ vs MC9S08SH8CPJ feature comparison

MC9S08SH8CPJ NXP Semiconductors

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MC9S08SH8CPJ Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description PLASTIC, DIP-20 PLASTIC, DIP-20
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e3 e3
Length 24.69 mm 24.69 mm
Number of I/O Lines 17 17
Number of Terminals 20 20
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified
RAM (bytes) 512
ROM (words) 8192
ROM Programmability FLASH FLASH
Seated Height-Max 5.08 mm 5.08 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 20
Moisture Sensitivity Level NOT SPECIFIED

Compare MC9S08SH8CPJ with alternatives

Compare MC9S08SH8CPJ with alternatives