MC9S08SH8CPJ vs MC9S08SH8CTG feature comparison

MC9S08SH8CPJ NXP Semiconductors

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MC9S08SH8CTG Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description PLASTIC, DIP-20 TSSOP-16
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T20 R-PDSO-G16
JESD-609 Code e3 e3
Length 24.69 mm 5 mm
Number of I/O Lines 17 17
Number of Terminals 20 16
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP20,.3 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 512
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 5.08 mm 1.2 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 7.62 mm 4.4 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code TSSOP
Pin Count 16
Moisture Sensitivity Level 3

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