MC9S08SH8MFKR vs MC9S08SH4CSCR feature comparison

MC9S08SH8MFKR NXP Semiconductors

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MC9S08SH4CSCR Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 4 X 4 MM, 1 MM HEIGHT, MO-220VGGD-6, QFN-24 MS-012AA, SOIC-8
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 8 8
Boundary Scan NO
Clock Frequency-Max 38.4 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code S-PQCC-N24 R-PDSO-G8
Length 4 mm
Number of I/O Lines 18
Number of Terminals 24 8
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Equivalence Code LCC24,.16SQ,20 SOP8,.25
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 256
ROM (words) 8192 4096
ROM Programmability FLASH FLASH
Speed 40 MHz 40 MHz
Supply Current-Max 7.7 mA 7.7 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 2.7 V
Supply Voltage-Nom 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Width 4 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Part Package Code SOIC
Pin Count 8
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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