MC9S08SH8MTJ vs MC9S08QD2MPC feature comparison

MC9S08SH8MTJ Rochester Electronics LLC

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MC9S08QD2MPC Freescale Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC FREESCALE SEMICONDUCTOR INC
Part Package Code TSSOP DIP
Package Description 0.65 MM PITCH, TSSOP-20 ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count 20 8
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 5 MHz 16 MHz
DAC Channels YES NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G20 R-PDIP-T8
JESD-609 Code e3 e3
Length 6.5 mm 9.779 mm
Moisture Sensitivity Level 3
Number of I/O Lines 17 6
Number of Terminals 20 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm 5.334 mm
Speed 40 MHz 16 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 2.7 V
Supply Voltage-Nom 5 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 4.4 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 2
ECCN Code EAR99
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
On Chip Program ROM Width 8
Package Equivalence Code DIP8,.3
Qualification Status Not Qualified
RAM (bytes) 128
ROM (words) 2048
Supply Current-Max 2.2 mA

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Compare MC9S08QD2MPC with alternatives