MC9S12B128CPVE
vs
MC9S12B128CPVE
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| ROM (words) |
131072
|
131072
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Bit Size |
|
16
|
| CPU Family |
|
CPU12
|
| JESD-30 Code |
|
S-PQFP-G112
|
| Number of Terminals |
|
112
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QFP
|
| Package Equivalence Code |
|
QFP112,.87SQ
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
4096
|
| ROM Programmability |
|
FLASH
|
| Speed |
|
16 MHz
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.635 mm
|
| Terminal Position |
|
QUAD
|
|
|
|
Compare MC9S12B128CPVE with alternatives
Compare MC9S12B128CPVE with alternatives