MC9S12DT128CFU vs MC9S12D64MPVE feature comparison

MC9S12DT128CFU Motorola Mobility LLC

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MC9S12D64MPVE NXP Semiconductors

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description QFP, LQFP-112
Pin Count 80
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 16 16
Bit Size 16 16
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G80 S-PQFP-G112
Length 14 mm 20 mm
Number of I/O Lines 91 91
Number of Terminals 80 112
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.45 mm 1.6 mm
Speed 25 MHz 25 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.35 V 2.35 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Rohs Code Yes
ECCN Code 3A991.A.2
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 5V SUPPLY
CPU Family CPU12
JESD-609 Code e3
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code QFP112,.87SQ
Peak Reflow Temperature (Cel) 260
RAM (bytes) 4096
ROM (words) 65536
Supply Current-Max 50 mA
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

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