MCF5271CVM150 vs GD80960JC-40 feature comparison

MCF5271CVM150 NXP Semiconductors

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GD80960JC-40 Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEL CORP
Package Description ROHS COMPLIANT, MAPBGA-196 BGA, BGA196(UNSPEC)
Reach Compliance Code compliant compliant
ECCN Code 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY OPERATING CASE TEMPERATURE 0 TO 100 C
Address Bus Width 24 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 20 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e1
Length 15 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 1
Number of Terminals 196 196
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Speed 150 MHz 40 MHz
Supply Voltage-Max 1.6 V 3.45 V
Supply Voltage-Min 1.4 V 3.15 V
Supply Voltage-Nom 1.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 196
Package Equivalence Code BGA196(UNSPEC)
Supply Current-Max 267 mA

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Compare GD80960JC-40 with alternatives