MCF5272CVF66 vs GD80960JS-16 feature comparison

MCF5272CVF66 NXP Semiconductors

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GD80960JS-16 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEL CORP
Package Description PLASTIC, BGA-196 BGA, BGA196(UNSPEC)
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Address Bus Width 23 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 16 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e0
Length 15 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 1
Number of Terminals 196 196
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Speed 66 MHz 16 MHz
Supply Voltage-Max 3.6 V 3.45 V
Supply Voltage-Min 3 V 3.15 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 196
Additional Feature OPERATING CASE TEMPERATURE 0 TO 100 C
Package Equivalence Code BGA196(UNSPEC)
Supply Current-Max 120 mA

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Compare GD80960JS-16 with alternatives