MCF5474VR266 vs MCF5475ZP266 feature comparison

MCF5474VR266 NXP Semiconductors

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MCF5475ZP266 NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TEPBGA-388 27 X 27 MM, MS-034AAL-1, PBGA-388
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e1 e4
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of DMA Channels 16
Number of Serial I/Os 4
Number of Terminals 388 388
On Chip Data RAM Width 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (words) 32768
Seated Height-Max 2.55 mm 2.55 mm
Speed 266.66 MHz 266.66 MHz
Supply Voltage-Max 1.58 V 1.58 V
Supply Voltage-Min 1.43 V 1.43 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Gold (Ni/Au)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare MCF5474VR266 with alternatives

Compare MCF5475ZP266 with alternatives