MCF5474VR266 vs XPC8240LZU200LC feature comparison

MCF5474VR266 NXP Semiconductors

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XPC8240LZU200LC Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description TEPBGA-388 LBGA,
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B352
JESD-609 Code e1
Length 27 mm 35 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of DMA Channels 16
Number of Serial I/Os 4
Number of Terminals 388 352
On Chip Data RAM Width 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (words) 32768
Seated Height-Max 2.55 mm 1.65 mm
Speed 266.66 MHz 200 MHz
Supply Voltage-Max 1.58 V 2.625 V
Supply Voltage-Min 1.43 V 2.375 V
Supply Voltage-Nom 1.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 352

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