MCIMX31LDVMN5D
vs
MPC8308ZQADDA
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
|
| Package Description |
19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473
|
,
|
| Pin Count |
473
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Additional Feature |
UNAVAILABLE FOR IMPORT OR SALE IN US
|
|
| Address Bus Width |
26
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
75 MHz
|
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B473
|
|
| JESD-609 Code |
e1
|
e0
|
| Length |
14 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
473
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
1.54 mm
|
|
| Speed |
532 MHz
|
|
| Supply Voltage-Max |
1.65 V
|
|
| Supply Voltage-Min |
1.52 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Samacsys Manufacturer |
|
NXP
|
| Technology |
|
CMOS
|
|
|
|