MCIMX536AVP8C2
vs
935311447557
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
TEBGA-529
|
,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
S-PBGA-B529
|
|
| JESD-609 Code |
e2
|
e2
|
| Length |
19 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
529
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
FBGA
|
|
| Package Equivalence Code |
BGA529,23X23,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.85 mm
|
|
| Supply Voltage-Max |
1.15 V
|
|
| Supply Voltage-Min |
1.05 V
|
|
| Supply Voltage-Nom |
1.1 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
TIN SILVER
|
TIN SILVER
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
19 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.31.00.01
|
|
|
|
Compare MCIMX536AVP8C2 with alternatives
Compare 935311447557 with alternatives