MCIMX6L2EVN10AC
vs
MCIMX6X2EVN10AC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Package Description |
Tfbga, Bga432,24x24,20
|
Lfbga, Bga400,20x20,32
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
5A992.C
|
5A992.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
13 Weeks
|
13 Weeks
|
| Date Of Intro |
2017-10-13
|
|
| JESD-30 Code |
S-PBGA-B432
|
S-PBGA-B400
|
| JESD-609 Code |
e1
|
e1
|
| Length |
13 Mm
|
17 Mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
432
|
400
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA432,24X24,20
|
BGA400,20X20,32
|
| Package Shape |
Square
|
Square
|
| Package Style |
Grid Array, Thin Profile, Fine Pitch
|
Grid Array, Low Profile, Fine Pitch
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.1 Mm
|
1.53 Mm
|
| Supply Voltage-Max |
1.5 V
|
1.5 V
|
| Supply Voltage-Min |
1.375 V
|
1.35 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
Ball
|
Ball
|
| Terminal Pitch |
0.5 Mm
|
0.8 Mm
|
| Terminal Position |
Bottom
|
Bottom
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
13 Mm
|
17 Mm
|
| uPs/uCs/Peripheral ICs Type |
Soc
|
Soc
|
| Base Number Matches |
1
|
1
|
|
|
|