MCIMX6L7DVN10AC
vs
MCIMX6X4CVM08AB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
TFBGA-432
|
MABGA-529
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
2 Days
|
|
Date Of Intro |
2017-10-13
|
|
Samacsys Manufacturer |
NXP
|
NXP
|
JESD-30 Code |
S-PBGA-B432
|
S-PBGA-B529
|
JESD-609 Code |
e1
|
e1
|
Length |
13 mm
|
19 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
432
|
529
|
Operating Temperature-Max |
95 °C
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
LFBGA
|
Package Equivalence Code |
BGA432,24X24,20
|
BGA529,23X23,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.1 mm
|
1.5 mm
|
Supply Voltage-Max |
1.5 V
|
1.5 V
|
Supply Voltage-Min |
1.375 V
|
1.275 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
13 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
|
|
|
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