MCIMX6L8DVN10AC
vs
MCIMX6X3EVO10AB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
TFBGA-432
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.31.00.01
|
|
| Factory Lead Time |
13 Weeks
|
|
| Date Of Intro |
2017-10-13
|
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| JESD-30 Code |
S-PBGA-B432
|
|
| JESD-609 Code |
e1
|
e1
|
| Length |
13 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
432
|
|
| Operating Temperature-Max |
95 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFBGA
|
|
| Package Equivalence Code |
BGA432,24X24,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max |
1.5 V
|
|
| Supply Voltage-Min |
1.375 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
13 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
|
|
|
Compare MCIMX6L8DVN10AC with alternatives