MCIMX6S5DVM10ABR
vs
935317895557
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Not Recommended
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Package Description |
MABGA-624
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-PBGA-B624
|
|
| JESD-609 Code |
e1
|
e1
|
| Length |
21 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
624
|
|
| Operating Temperature-Max |
95 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA624,25X25,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.5 mm
|
|
| Supply Voltage-Max |
1.5 V
|
|
| Supply Voltage-Min |
1.35 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
21 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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