MCIMX6S5DVM10AD
vs
935360456557
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
MABGA-624
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Factory Lead Time |
18 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
S-PBGA-B624
|
|
| JESD-609 Code |
e1
|
e1
|
| Length |
21 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
624
|
|
| Operating Temperature-Max |
95 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA624,25X25,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max |
1.5 V
|
|
| Supply Voltage-Min |
1.35 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
21 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MCIMX6S5DVM10AD with alternatives
Compare 935360456557 with alternatives