MCIMX6S8DVM10AC
vs
XAM5718AABCXEA
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Package Description |
MABGA-624
|
FBGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.31.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
S-PBGA-B624
|
S-PBGA-B760
|
| JESD-609 Code |
e1
|
e1
|
| Length |
21 mm
|
23 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
624
|
760
|
| Operating Temperature-Max |
95 °C
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
FBGA
|
| Package Equivalence Code |
BGA624,25X25,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
250
|
| Seated Height-Max |
1.6 mm
|
2.96 mm
|
| Supply Voltage-Max |
1.5 V
|
1.2 V
|
| Supply Voltage-Min |
1.35 V
|
1.11 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
21 mm
|
23 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2016-05-14
|
| Address Bus Width |
|
16
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
38.4 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
NO
|
| Low Power Mode |
|
YES
|
| Speed |
|
1500 MHz
|
| Supply Voltage-Nom |
|
1.15 V
|
|
|
|
Compare MCIMX6S8DVM10AC with alternatives
Compare XAM5718AABCXEA with alternatives