MCIMX6X3CVO08AB
vs
AM3352BZCZA60
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
NFBGA-324
|
| ECCN Code |
|
5A992.C
|
| HTS Code |
|
8542.31.00.01
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Address Bus Width |
|
28
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
26 MHz
|
| External Data Bus Width |
|
16
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-PBGA-B324
|
| Length |
|
15 mm
|
| Low Power Mode |
|
YES
|
| Number of DMA Channels |
|
64
|
| Number of Terminals |
|
324
|
| On Chip Data RAM Width |
|
8
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA324,18X18,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (words) |
|
131072
|
| Seated Height-Max |
|
1.4 mm
|
| Speed |
|
600 MHz
|
| Supply Current-Max |
|
400 mA
|
| Supply Voltage-Max |
|
1.144 V
|
| Supply Voltage-Min |
|
1.056 V
|
| Supply Voltage-Nom |
|
1.1 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
15 mm
|
|
|
|
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