MCIMX6X3CVO08AB
vs
XAM5718AABCXEA
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
FBGA,
|
| Date Of Intro |
|
2016-05-14
|
| Address Bus Width |
|
16
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
38.4 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
NO
|
| JESD-30 Code |
|
S-PBGA-B760
|
| Length |
|
23 mm
|
| Low Power Mode |
|
YES
|
| Number of Terminals |
|
760
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
FBGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Seated Height-Max |
|
2.96 mm
|
| Speed |
|
1500 MHz
|
| Supply Voltage-Max |
|
1.2 V
|
| Supply Voltage-Min |
|
1.11 V
|
| Supply Voltage-Nom |
|
1.15 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
23 mm
|
|
|
|
Compare XAM5718AABCXEA with alternatives