MCK16Z4MFC16B1
vs
MCK16Z4MFC16B1
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Package Description |
PLASTIC, QFP-132
|
PLASTIC, QFP-132
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
NO
|
| Address Bus Width |
24
|
24
|
| Bit Size |
16
|
16
|
| CPU Family |
6816
|
6816
|
| Clock Frequency-Max |
16.78 MHz
|
5.2 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G132
|
S-PQFP-G132
|
| JESD-609 Code |
e0
|
|
| Length |
24.13 mm
|
24.13 mm
|
| Number of I/O Lines |
23
|
37
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BQFP
|
BQFP
|
| Package Equivalence Code |
SPQFP132,1.1SQ
|
SPQFP132,1.1SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK, BUMPER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
1024
|
1024
|
| Seated Height-Max |
4.572 mm
|
4.572 mm
|
| Speed |
16.78 MHz
|
25.17 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.13 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Boundary Scan |
|
NO
|
| ROM Programmability |
|
ROM LESS
|
| Supply Current-Max |
|
65 mA
|
|
|
|